產(chǎn)品中心
光電二極管芯片COC |Albis
InGaAs二極管芯片
載體芯片(Chip on Carrier)通過與客戶的密切合作，Albis開發(fā)了復雜的裝配解決方案，可滿足對準精度、帶寬和布局復雜性方面的嚴格要求。Albis雪崩和pin光電二極管產(chǎn)品組合現(xiàn)在可以作為倒裝芯片安裝或引線鍵合器件在定制的2D或3D(環(huán)繞式)載體上提供。
主要特征 
返回列表頁產(chǎn)品特點
·PIN or APD類型可選
典型應用
.單通道、陣列形式可選
產(chǎn)品特征
·多種速率可選
標準模塊光學參數(shù)
| p-i-n Photodiodes - Chip on Carrier | ||||
|---|---|---|---|---|
| Product | Speed | Channels | Carrier Type | |
| PS60x1 | 112 Gbaud | 1 | ceramic submount | |
| PS40X1 | 56 Gbaud | 1 | ceramic submount | |
| PS40X4 | 56 Gbaud | multiple | ceramic submount | |
| PS20x1 | 28 Gb/s | 1 | ceramic submount | |
| PS20Xn | 28 Gb/s | multiple | ceramic submount | |
| PSO5F1 | 10 Gb/s | 1 | wrap-around submount | |
| PS05J4 | 2.5 Gb/s | 4 | wrap-around submount | |
| PS05J8 | 2.5 Gb/s | 8 | wrap-around submount | |
| APD - Chip on Carrier | ||||
| Product | Speed | Channels | Carrier Type | |
| APS20D1 | 28 Gb/s | 1 | ceramic submount | |
| APS20B1/C1 | 25 Gb/s | 1 | ceramic submount |
